Camera-based stereoscopic 3D shape, stress and deformation measurement.

DIC systems (digital image correlation) can be used very flexibly regardless of the shape, temperature and size of the measuring object and can measure strains in the microstrain range (sub-micrometers) using microscope optics, as well as strain factors of several 100%, or even extreme measurement rates with high-speed cameras. Using the method of digital image correlation (grey value correlation, near-field photogrammetry), they can be used for both 2D and 3D applications. Typical applications from industry and research are motion and deformation analysis, material characterization, component testing and photogrammetric measurement ...